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370HR HDI Printed Circuit Boards with 6-layer Layer-up Built on Isola Laminates With Castellated vias and Impedance Control

Shipped: 4th-Aug-2023

Introducing our high-quality 6-layer rigid PCB, offered with top-of-the-line materials and advanced construction techniques. This PCB is perfect for various electronic applications, meeting demanding requirements. Let's explore the key features and specifications that make this PCB an excellent choice for your projects.

The PCB material used is Isola 370HR, a high-performance FR-4 system with a glass transition temperature (Tg) of 180°C. It ensures reliable operation even under high-temperature conditions. With a process dielectric constant (DK) of 3.92 at 5-10 GHz/23°C, efficient signal transmission is guaranteed. The low dissipation factor of 0.025 at 5-10 GHz/23°C minimizes signal loss. The material has a Td (Decomposition Temperature) of 340°C, ensuring durability. It operates flawlessly within a wide temperature range of -40℃ to +130℃.

The 6-layer stackup provides ample space for component placement and efficient signal trace. Copper layers are 35 microns thick, offering excellent conductivity. The core material is made of 370HR with a thickness of 0.18 microns, providing structural stability. Prepreg layers, with a thickness of 0.135mm, offer insulation and bonding between the layers.

In terms of construction, the PCB has precise board dimensions of 178.25mm x 96.34mm, ensuring compatibility with specific requirements. It maintains a minimum trace/space of 3.5/4 mils, allowing for intricate circuit designs. The minimum hole size of 0.25mm facilitates accurate component mounting. The PCB features blind vias between Layer 1 and Layer 2, as well as between Layer 5 and Layer 6, optimizing space utilization. Additionally, buried vias are present between Layer 2 and Layer 3, as well as between Layer 3 and Layer 4, ensuring efficient signal routing.

With a finished board thickness of 1.05mm and a 1 oz (1.4 mils) copper weight per layer, this PCB strikes a balance between durability and flexibility. The via plating thickness of 20 μm ensures reliable electrical connections. The surface finish utilizes Electroless Nickel Immersion Gold (ENIG), providing excellent corrosion resistance and solderability. The top and bottom solder masks are matte black, while the silkscreen is precisely applied in white, except for solder pads where it is intentionally omitted for better soldering performance.

To enhance reliability, 0.25mm and 0.4mm vias are filled with resin and capped according to IPC-4761 Type VII standards. The PCB maintains a controlled 50-ohm impedance on the top layer with reference to Layer 2. Castellated vias on the edge facilitate easy integration into your system. Each PCB undergoes a thorough 100% electrical test before shipment, ensuring optimal performance.

In terms of statistics, this PCB supports up to 128 components with a total of 253 pads. It includes 129 thru-hole pads, 45 top surface mount technology (SMT) pads, and 79 bottom SMT pads. With 237 vias and 9 nets, this PCB offers versatility for various circuit designs. The artwork is supplied in the widely accepted Gerber RS-274-X format, meeting IPC-Class-2 standards for high reliability and performance. This PCB is available for worldwide shipping, ensuring customers from different regions can benefit from its exceptional quality and performance. For any technical inquiries or further assistance, please feel free to contact our dedicated team at sales@bicheng-enterprise.com. We are here to provide you with comprehensive support and guidance throughout your PCB selection and implementation process.

Specifications	Value
PCB Material	Isola 370HR 180°C glass transition temperature (Tg) FR-4 system
	Process DK 3.92, at 5-10 GHz/23°C
	Dissipation factor 0.025, at 5-10 GHz/23°C
	Tg = 180 °C, Td = 340°C
	-40℃?to +130℃?operation
Stackup
Copper Layer-1	35 micron
370HR Prepreg	1080(65%) x 2, 0.135mm
Copper Layer-2	35 micron
370HR Core	0.18 micron
Copper Layer-3	35 micron
370HR Prepreg	1080(65%) x 2, 0.135mm
Copper Layer-4	35 micron
370HR Core	0.18 micron
Copper Layer-5	35 micron
370HR Prepreg	1080(65%) x 2, 0.135mm
Copper Layer-6	35 micron
Construction details
Board dimensions	178.25mm x 96.34 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	3.5/4 mils
Minimum Hole Size	0.25mm
Blind via	L1-L2, L5-L6
Buried via	L2-L3, L3-L4
Finished board thickness	1.05mm
Finished Cu weight	1 oz (1.4 mils) each layer
Via plating thickness	20 μm
Surface finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Matt black
Bottom Solder Mask	Matt black
Silkscreen	Silkscreen is forbidden on solder pads
Via filling	0.25mm and 0.4mm vias are filled by resin and capped as per IPC-4761 Type VII
Impedance match	50 ohm impedance controlled on top layer, reference L2
Edge metalization	Castellated vias on edge
Electrical Test	100% Electrical test used prior to shipment
PCB Statistics
Components	128
Total Pads	253
Thru Hole Pads	129
Top SMT Pads	45
Bottom SMT Pads	79
Vias	237
Nets	9
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Availability	worldwide

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